Short Introduction
Unexpanded microspheres play a crucial role in enhancing various properties of board materials. These tiny particles, when properly dispersed and expanded, can significantly impact the characteristics and performance of the board. By understanding the mechanisms behind the behavior of unexpanded microcapsule in board applications, we can delve deeper into how they contribute to improvements in bulk, thickness, stiffness, and other key properties.
Benefits of Applying Microcapsule in Board Materials
Unexpanded microspheres are commonly used in the production of board materials to achieve specific performance enhancements. These microcapsule are typically delivered in a slurry form, ready for incorporation into the board manufacturing process. The presence of unexpanded microspheres in the board formulation introduces the potential for increased bulk and thickness, which are essential factors in determining the overall quality and functionality of the board product.
1-Higher bulk density
One of the primary benefits of incorporating unexpanded microcapsule into board materials is the improvement in bulk. The addition of these microspheres allows for a significant increase in the specific volume of the board, leading to a higher bulk density. This increase in bulk is directly related to the retention of unexpanded microcapsule in the board matrix. Studies have shown that for every percentage of unexpanded microspheres retained in the board, the bulk can increase by 18 to 25 percent. This enhancement in bulk is particularly advantageous for applications where a lightweight yet voluminous board is desired.
2-Improvements in thickness
Furthermore, the presence of unexpanded microcapsule in the board formulation can also contribute to improvements in thickness. When unexpanded microspheres are dispersed within the board matrix, they have the potential to expand significantly under specific conditions, such as elevated temperatures. As the microcapsule expand, they create a cellular structure within the board, leading to an increase in thickness. This increase in thickness can be particularly beneficial for applications where dimensional stability and rigidity are important factors.
3-Enhancing the stiffness
In addition to bulk and thickness improvements, unexpanded microspheres also play a key role in enhancing the stiffness of board materials. By incorporating these microcapsule into the board formulation, manufacturers can achieve a higher level of stiffness without significantly increasing the basis weight of the board. This is especially advantageous in situations where mills producing boxboard need to meet bending stiffness requirements without exceeding specified basis weight limits. The stiffness-enhancing effect of unexpanded microspheres can help manufacturers optimize the performance of their board products while maintaining cost-effectiveness.
4-Thermal insulation, soft touch, and anti-slip
Moreover, unexpanded microcapsule can also contribute to other desirable properties of board materials, such as thermal insulation, soft touch, and anti-slip characteristics. The unique composition of unexpanded microspheres, with a copolymer shell encapsulating a blowing agent, allows for the expansion of the microcapsule when exposed to temperatures above a certain threshold. This expansion results in a significant increase in volume, leading to improvements in thermal insulation properties. Additionally, the soft touch and anti-slip properties imparted by unexpanded microspheres can enhance the tactile feel and usability of the board material in various applications.
How to apply microcapsule in board materials?
1-Proper preparation and dispersion
In the context of board manufacturing processes, the proper preparation and dispersion of unexpanded microcapsule are essential to ensure their effective utilization in enhancing board properties. It is crucial to disperse the microspheres in a slurry form and prevent settling to maintain their functionality throughout the manufacturing process. The use of suitable mixers with specific characteristics, such as adjustable mounting, double propellers, and appropriate power and speed settings, can facilitate the dispersion of unexpanded microcapsule in the board matrix.
2-The addition of unexpanded microspheres
Furthermore, the addition of unexpanded microspheres to the board machine at specific dosage points, preferably in the middle layers of a multilayer board machine, can maximize their impact on board properties. The expansion of microcapsule in the drying section of the board machine, typically at temperatures between 70 to 75°C, is a critical step in achieving the desired bulk and thickness enhancements. It is essential to ensure that the expanded microspheres are resistant enough to withstand mechanical stresses at higher temperatures to maintain the desired board properties.
Unexpanded microcapsule play a vital role in improving various properties of board materials, including bulk, thickness, stiffness, thermal insulation, soft touch, and anti-slip characteristics. By understanding the behavior and mechanisms of unexpanded microspheres in board applications, manufacturers can leverage their unique properties to enhance the performance and functionality of board products. Proper preparation, dispersion, and dosage of unexpanded microcapsule in the board manufacturing process are essential to maximize their impact and achieve the desired enhancements in board properties.
For more applications, please check our application sections:
https://www.expandablemicrosphere.com/applications
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